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 sas - electronics











 



HDI ( High Density Interconnect ) printed circuit board (PCB)

Manufacturing capabilities



 Stack up depending on customer requirements
 Laser drill size 100 - 152 µm
 Line width/space (no resign plug) 70,0 µm
 Line width/space (with resign plug) 87,5 µm
 Laser pad 300 µm (225 µm for sample)
 Mechanical hole pad 450 µm (350 µm for sample)