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Alu based printed circuit board (PCB)

Extract of possible base materials

manufacturer / type data sheet
Aluminium 1050
2124
5052 » download
6061
Copper C11000


Surface



 HAL - Pb free
 HAL leaded
 Immersion tin
 Immersion silver
 Electroless nickel / immersion gold
 Galvanic nickel gold
 OSP


Manufacturing capabilities


data sheet
 Stack up depending on customer requirements » download
 Via Pad min. Ø 500 µm
 Conductor track width. min 50 µm
 PTH hole min. Ø 1000 µm
 Via hole annular min. 100 µm
 Component annular min. 200 µm
 Blind Via hole min. Ø 50 µm
 Buried Via hole min. Ø 150 µm
 Press fit +/- 0,05 mm
 Edgeplating yes
 Copper filled Blind Vias yes
 Resign filled Blind Vias yes
 Soldermask Plugged Vias yes
 Resign Plugged Vias yes
 Copper outlayers size max. up to 420µm
 Copper inlayers size max. up to 420µm
 Board thickness min. 0,5 mm
 Board thickness max. 6,0 mm
 Board size max. 457 mm x 609 mm
 Goldfingers galvanic nickel gold depending on customer requirements
 Soldermask green/white/black/red et al.
 Marking print white/black/yellow et al.
 Carbon print yes