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 sas - electronics











 



Flexible printed circuit board (PCB)

Extract of possible base materials

manufacturer / type data sheet
 FCCL (adhesive) Shengyi SF302 » download
 FCCL (adhesiveless) Panasonic R-F775 » download
 Coverlay Shengyi SF302C » download
 Adhesive Taiflex BT
 PI stiffener Taiflex MHK » download
 3M 9460, 6677, 9458 » download
 3M 468 » download


Surface



 HAL leaded
 Immersion silver
 Electroless nickel / immersion gold
 Galvanic nickel gold
 OSP


Manufacturing capabilities


 Stack up 1 to 8
 Via Pad min. Ø 500 µm
 Conductor track width. min 75 µm
 Via hole min. Ø 100 µm
 Via hole annular min. 100 µm
 Component annular min. 200 µm
 Copper outlayers size max. up to105 µm
 Copper inlayers size max. up to 105 µm
 Board thickness min. 0,1 mm
 Board thickness max. 0,8 mm
 Max. Abmessung der Leiterplatte 220 mm x 575 mm
 Soldermask green
 Marking print white/yellow



  • Produkt 1
    Produkt 2
    Produkt 3