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Rigid printed circuit board (PCB)

Extract of possible base materials

manufacturer / type data sheet
 FR4 TG 135 ITEQ / 140 » download
 FR4 TG 170 KingBoard / KB 6167 » download
 FR4 TG 180 ITEQ » download


Surface


 HAL - Pb free
 HAL leaded
 Immersion tin
 Immersion silver
 Electroless nickel / immersion gold (ENIG)
 Galvanic nickel gold
 OSP


Manufacturing capabilities



 Stack up depending on customer requirements
 Via Pad min. Ø 500 µm
 Conductor track width. min 50 µm
 Via hole min. Ø 200 µm
 Via hole annular min. 100 µm
 Component annular min. 200 µm
 Blind Via hole min. Ø 50 µm
 Buried Via hole min. Ø 150 µm
 Press fit +/- 0,05 mm
 Edgeplating yes
 Copper filled Blind Vias yes
 Resign filled Blind Vias yes
 Soldermask Plugged Vias yes
 Resign Plugged Vias yes
 Copper outlayers max. up to 420 µm
 Copper inlayers up to 420 µm
 Board thickness min. 0,16 mm
 Board thickness max. 6,0 mm
 Board size max. 500 mm x 1000 mm
 Gold finger galvanic nickel gold depending on customer requirements
 Soldermask green/white/black/red et al.
 Marking print white/black/yellow et al.
 Carbon print yes



  • Produkt 1
    Produkt 2
    Produkt 3